MA4P505-1072T
vs
MA4P505-1072
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
M/A-COM TECHNOLOGY SOLUTIONS INC
|
M/A-COM TECHNOLOGY SOLUTIONS INC
|
Package Description |
ROHS COMPLIANT, CERAMIC, CASE 1072T, 2 PIN
|
HERMETIC SEALED, CERAMIC, CASE 1072, 2 PIN
|
Pin Count |
2
|
2
|
Manufacturer Package Code |
CASE 1072T
|
CASE 1072
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.10.00.40
|
8541.10.00.80
|
Samacsys Manufacturer |
MACOM
|
|
Additional Feature |
HIGH RELIABILITY, HIGH VOLTAGE, LOW LEAKAGE CURRENT
|
HIGH RELIABILITY
|
Application |
SWITCHING
|
SWITCHING
|
Breakdown Voltage-Min |
500 V
|
500 V
|
Case Connection |
CATHODE
|
|
Configuration |
SINGLE
|
SINGLE
|
Diode Capacitance-Max |
0.65 pF
|
0.65 pF
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Forward Resistance-Max |
0.45 Ω
|
0.45 Ω
|
Diode Res Test Current |
100 mA
|
100 mA
|
Diode Res Test Frequency |
100 MHz
|
100 MHz
|
Diode Type |
PIN DIODE
|
PIN DIODE
|
JESD-30 Code |
S-CUUC-N2
|
R-CDSO-R2
|
Minority Carrier Lifetime-Nom |
2 µs
|
2 µs
|
Number of Elements |
1
|
1
|
Number of Terminals |
2
|
2
|
Operating Temperature-Max |
175 °C
|
150 °C
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
UNCASED CHIP
|
SMALL OUTLINE
|
Peak Reflow Temperature (Cel) |
265
|
NOT SPECIFIED
|
Power Dissipation-Max |
1.5 W
|
1.5 W
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Surface Mount |
YES
|
YES
|
Technology |
POSITIVE-INTRINSIC-NEGATIVE
|
POSITIVE-INTRINSIC-NEGATIVE
|
Terminal Form |
NO LEAD
|
WRAP AROUND
|
Terminal Position |
UPPER
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
5
|
NOT SPECIFIED
|
Base Number Matches |
1
|
2
|
Diode Capacitance-Nom |
|
0.6 pF
|
|
|
|