M95640-WDW4TP/K
vs
X84640PG-2.5
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
STMICROELECTRONICS
IC MICROSYSTEMS SDN BHD
Part Package Code
SOIC
DIP
Package Description
0.169 INCH, HALOGEN FREE AND ROHS COMPLIANT, TSSOP-8
DIP,
Pin Count
8
8
Reach Compliance Code
compliant
unknown
ECCN Code
3A001.A.2.A
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Clock Frequency-Max (fCLK)
10 MHz
5 MHz
JESD-30 Code
R-PDSO-G8
R-PDIP-T8
Length
4.4 mm
10.03 mm
Memory Density
65536 bit
65536 bit
Memory IC Type
EEPROM
EEPROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
8
8
Number of Words
8192 words
8192 words
Number of Words Code
8000
8000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
145 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
8KX8
8KX8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
IN-LINE
Parallel/Serial
SERIAL
SERIAL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
NOT SPECIFIED
Seated Height-Max
1.2 mm
4.32 mm
Serial Bus Type
SPI
3-WIRE
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
2.5 V
2.5 V
Supply Voltage-Nom (Vsup)
5 V
3 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
COMMERCIAL
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
0.65 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
NOT SPECIFIED
Width
3 mm
7.62 mm
Write Cycle Time-Max (tWC)
4 ms
5 ms
Base Number Matches
1
1
Qualification Status
Not Qualified
Supply Current-Max
0.002 mA
Compare M95640-WDW4TP/K with alternatives
Compare X84640PG-2.5 with alternatives