M95256-WCS6TG/K vs X24256BIG-2.5 feature comparison

M95256-WCS6TG/K STMicroelectronics

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X24256BIG-2.5 IC Microsystems Sdn Bhd

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Part Life Cycle Code Not Recommended Obsolete
Ihs Manufacturer STMICROELECTRONICS IC MICROSYSTEMS SDN BHD
Package Description WLCSP-8 BGA, BGA8,2X4,40/32
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Clock Frequency-Max (fCLK) 20 MHz 0.4 MHz
JESD-30 Code R-PBGA-B8 R-PBGA-B8
Length 1.358 mm 3.4798 mm
Memory Density 262144 bit 262144 bit
Memory IC Type EEPROM EEPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 32768 words 32768 words
Number of Words Code 32000 32000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 32KX8 32KX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VFBGA BGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY
Parallel/Serial SERIAL SERIAL
Seated Height-Max 0.58 mm
Serial Bus Type SPI I2C
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 2.5 V 2.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form BALL BALL
Terminal Pitch 0.4 mm
Terminal Position BOTTOM BOTTOM
Width 1.271 mm 2 mm
Write Cycle Time-Max (tWC) 5 ms 10 ms
Base Number Matches 1 1
Rohs Code Yes
Part Package Code BGA
Pin Count 8
Data Retention Time-Min 100
Endurance 100000 Write/Erase Cycles
I2C Control Byte 10100DDR
Package Equivalence Code BGA8,2X4,40/32
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified
Standby Current-Max 0.001 A
Supply Current-Max 0.003 mA
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Write Protection HARDWARE

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