M95160-FCS6G/G
vs
M95160-FCS6TP/S
feature comparison
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
STMICROELECTRONICS
|
STMICROELECTRONICS
|
Package Description |
,
|
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.51
|
8542.32.00.51
|
Memory IC Type |
EEPROM
|
EEPROM
|
Serial Bus Type |
SPI
|
SPI
|
Base Number Matches |
1
|
1
|
Pbfree Code |
|
Yes
|
Rohs Code |
|
Yes
|
Data Retention Time-Min |
|
40
|
Endurance |
|
1000000 Write/Erase Cycles
|
JESD-30 Code |
|
S-PBGA-B8
|
JESD-609 Code |
|
e3
|
Memory Density |
|
16384 bit
|
Memory Width |
|
8
|
Moisture Sensitivity Level |
|
1
|
Number of Terminals |
|
8
|
Number of Words |
|
2048 words
|
Number of Words Code |
|
2000
|
Operating Temperature-Max |
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Organization |
|
2KX8
|
Package Body Material |
|
PLASTIC/EPOXY
|
Package Code |
|
FBGA
|
Package Equivalence Code |
|
BGA8,3X3,16
|
Package Shape |
|
SQUARE
|
Package Style |
|
GRID ARRAY, FINE PITCH
|
Parallel/Serial |
|
SERIAL
|
Qualification Status |
|
Not Qualified
|
Standby Current-Max |
|
0.000001 A
|
Supply Current-Max |
|
0.003 mA
|
Surface Mount |
|
YES
|
Technology |
|
CMOS
|
Temperature Grade |
|
INDUSTRIAL
|
Terminal Finish |
|
MATTE TIN
|
Terminal Form |
|
BALL
|
Terminal Pitch |
|
0.4 mm
|
Terminal Position |
|
BOTTOM
|
Write Protection |
|
HARDWARE/SOFTWARE
|
|
|
|
Compare M95160-FCS6G/G with alternatives
Compare M95160-FCS6TP/S with alternatives