M95040-WMB6TG
vs
93LC66A-E/MNY
feature comparison
All Stats
Differences Only
Pbfree Code
Yes
Rohs Code
Yes
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
STMICROELECTRONICS
MICROCHIP TECHNOLOGY INC
Part Package Code
SOIC
DFN
Package Description
2 X 3 MM, ROHS COMPLIANT, MLP-8
HVSON,
Pin Count
8
8
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Clock Frequency-Max (fCLK)
10 MHz
2 MHz
Data Retention Time-Min
40
Endurance
1000000 Write/Erase Cycles
JESD-30 Code
R-XDSO-N8
R-PDSO-N8
Length
3 mm
3 mm
Memory Density
4096 bit
4096 bit
Memory IC Type
EEPROM
EEPROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
8
8
Number of Words
512 words
512 words
Number of Words Code
512
512
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
512X8
512X8
Package Body Material
UNSPECIFIED
PLASTIC/EPOXY
Package Code
VSON
HVSON
Package Equivalence Code
SOLCC8,.11,20
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, VERY THIN PROFILE
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Parallel/Serial
SERIAL
SERIAL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Seated Height-Max
0.6 mm
0.8 mm
Serial Bus Type
SPI
MICROWIRE
Standby Current-Max
0.000002 A
Supply Current-Max
0.002 mA
0.002 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
2.5 V
2.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
AUTOMOTIVE
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
2 mm
2 mm
Write Cycle Time-Max (tWC)
5 ms
6 ms
Write Protection
HARDWARE/SOFTWARE
Base Number Matches
1
1
JESD-609 Code
e4
Screening Level
AEC-Q100
Terminal Finish
NICKEL PALLADIUM GOLD
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