M93C66-BN5
vs
NM93C66MN
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
STMICROELECTRONICS
|
NATIONAL SEMICONDUCTOR CORP
|
| Part Package Code |
DIP
|
DIP
|
| Package Description |
PLASTIC, SDIP-8
|
DIP, DIP8,.3
|
| Pin Count |
8
|
8
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| ECCN Code |
EAR99
|
3A001.A.2.C
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Additional Feature |
CONFIGURABLE AS 256 X 16
|
MICROWIRE BUS INTERFACE; AUTOMATIC WRITE; DATA RETENTION = 40 YEARS
|
| Alternate Memory Width |
8
|
|
| Clock Frequency-Max (fCLK) |
1 MHz
|
0.5 MHz
|
| Data Retention Time-Min |
40
|
40
|
| Endurance |
1000000 Write/Erase Cycles
|
1000000 Write/Erase Cycles
|
| JESD-30 Code |
R-PDIP-T8
|
R-PDIP-T8
|
| JESD-609 Code |
e0
|
e0
|
| Length |
9.55 mm
|
9.817 mm
|
| Memory Density |
4096 bit
|
4096 bit
|
| Memory IC Type |
EEPROM
|
EEPROM
|
| Memory Width |
16
|
16
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Number of Words |
256 words
|
256 words
|
| Number of Words Code |
256
|
256
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-20 °C
|
-55 °C
|
| Organization |
256X16
|
256X16
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP8,.3
|
DIP8,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Parallel/Serial |
SERIAL
|
SERIAL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
5.9 mm
|
5.08 mm
|
| Serial Bus Type |
MICROWIRE
|
MICROWIRE
|
| Standby Current-Max |
0.00005 A
|
0.0001 A
|
| Supply Current-Max |
0.0015 mA
|
0.004 mA
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
OTHER
|
MILITARY
|
| Terminal Finish |
TIN LEAD
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.62 mm
|
7.62 mm
|
| Write Cycle Time-Max (tWC) |
10 ms
|
10 ms
|
| Write Protection |
SOFTWARE
|
SOFTWARE
|
| Base Number Matches |
1
|
2
|
| Output Characteristics |
|
3-STATE
|
|
|
|
Compare M93C66-BN5 with alternatives
Compare NM93C66MN with alternatives