M93C66-BN3/S
vs
M93C66-BN7G
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
STMICROELECTRONICS
STMICROELECTRONICS
Part Package Code
DIP
DIP
Package Description
DIP,
ROHS COMPLIANT, PLASTIC, DIP-8
Pin Count
8
8
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Alternate Memory Width
8
8
Clock Frequency-Max (fCLK)
2 MHz
2 MHz
JESD-30 Code
R-PDIP-T8
R-PDIP-T8
Length
9.27 mm
9.27 mm
Memory Density
4096 bit
4096 bit
Memory IC Type
EEPROM
EEPROM
Memory Width
16
16
Number of Functions
1
1
Number of Terminals
8
8
Number of Words
256 words
256 words
Number of Words Code
256
256
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
125 °C
105 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
256X16
256X16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
SERIAL
SERIAL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.33 mm
5.33 mm
Serial Bus Type
MICROWIRE
MICROWIRE
Supply Current-Max
0.002 mA
0.0015 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
INDUSTRIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
7.62 mm
Write Cycle Time-Max (tWC)
5 ms
5 ms
Base Number Matches
1
1
Rohs Code
Data Retention Time-Min
40
Endurance
1000000 Write/Erase Cycles
JESD-609 Code
e3
Package Equivalence Code
DIP8,.3
Standby Current-Max
0.00005 A
Terminal Finish
MATTE TIN
Write Protection
SOFTWARE
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