M93C46-RDW3TP/K
vs
M93C46-RDW6
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
STMICROELECTRONICS
STMICROELECTRONICS
Package Description
TSSOP,
0.169 INCH, TSSOP-8
Reach Compliance Code
compliant
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Factory Lead Time
14 Weeks
kg CO2e/kg
12
12
Average Weight (mg)
40.65
40.65
CO2e (mg)
487.8
487.8
Samacsys Description
• Industry standard MICROWIRE™ bus\r\n• Memory array: 1 Kb, 2 Kb, 4 Kb, 8 Kb or 16 Kb\r\n• Dual organization: by word (x16) or byte (x8)\r\n• Write\r\n– Byte within 4 ms\r\n– Word within 4 ms\r\n• READY/BUSY signal during programming\r\n• 2 MHz clock rate\r\n• Sequential read operation\r\n• Single supply voltage: 1.8 V to 5.5 V\r\n• Operating temperature range: -40 °C up to\r\n125 °C\r\n• Enhanced ESD protection\r\n• Write cycle endurance\r\n– 4 million Write cycles at 25 °C\r\n– 1.2 million Write cycles at 85 °C\r\n– 600 k Write cycles a
Samacsys Manufacturer
STMicroelectronics
Samacsys Modified On
2024-07-15 04:45:31
Total Weight
34
34
Category CO2 Kg
12
12
CO2
408
408
Compliance Temperature Grade
Automotive: -40C to +125C
Industrial: -40C to +85C
EU RoHS Version
RoHS 2 (2015/863/EU)
Candidate List Date
2024-06-27
2024-06-27
CAS Accounted for Wt
93
100
CA Prop 65 Presence
YES
YES
CA Prop 65 CAS Numbers
1333-86-4, 7440-02-0
79-94-7, 1309-64-4, 7439-92-1
EFUP
e
50
Conflict Mineral Status
DRC Conflict Free Undeterminable
DRC Conflict Free Undeterminable
Conflict Mineral Status Source
CMRT V6.31
FMD
Qualifications
AEC-Q100
Alternate Memory Width
8
8
Clock Frequency-Max (fCLK)
2 MHz
1 MHz
JESD-30 Code
R-PDSO-G8
R-PDSO-G8
JESD-609 Code
e4
e0
Length
4.4 mm
4.4 mm
Memory Density
1024 bit
1024 bit
Memory IC Type
EEPROM
EEPROM
Memory Width
16
16
Moisture Sensitivity Level
1
Number of Functions
1
1
Number of Terminals
8
8
Number of Words
64 words
64 words
Number of Words Code
64
64
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
64X16
64X16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
TSSOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial
SERIAL
SERIAL
Peak Reflow Temperature (Cel)
260
Screening Level
AEC-Q100
Seated Height-Max
1.2 mm
1.2 mm
Serial Bus Type
MICROWIRE
MICROWIRE
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
1.8 V
1.8 V
Supply Voltage-Nom (Vsup)
2.5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
INDUSTRIAL
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
TIN LEAD
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Width
3 mm
3 mm
Write Cycle Time-Max (tWC)
4 ms
10 ms
Base Number Matches
1
1
Rohs Code
parentfamilyid
4191392
Part Package Code
SOIC
Pin Count
8
SVHC Over MCV
7439-92-1, 79-94-7
Data Retention Time-Min
40
Endurance
1000000 Write/Erase Cycles
Package Equivalence Code
TSSOP8,.25
Qualification Status
Not Qualified
Standby Current-Max
0.000002 A
Supply Current-Max
0.002 mA
Write Protection
SOFTWARE
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