M7A3P1000-1FG484I
vs
M7A3P1000-FGG484II
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Not Recommended
Transferred
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROSEMI CORP
Package Description
23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-484
BGA,
Reach Compliance Code
compliant
compliant
Factory Lead Time
12 Weeks
Clock Frequency-Max
350 MHz
350 MHz
JESD-30 Code
S-PBGA-B484
S-PBGA-B484
JESD-609 Code
e0
Length
27 mm
23 mm
Moisture Sensitivity Level
3
3
Number of CLBs
24576
24576
Number of Equivalent Gates
1000000
1000000
Number of Inputs
300
Number of Logic Cells
24576
Number of Outputs
300
Number of Terminals
484
484
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
24576 CLBS, 1000000 GATES
24576 CLBS, 1000000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Packing Method
TRAY
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.44 mm
2.44 mm
Supply Voltage-Max
1.575 V
1.575 V
Supply Voltage-Min
1.425 V
1.425 V
Supply Voltage-Nom
1.5 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
27 mm
23 mm
Base Number Matches
2
1
HTS Code
8542.39.00.01
Peak Reflow Temperature (Cel)
250
Time@Peak Reflow Temperature-Max (s)
30
Compare M7A3P1000-1FG484I with alternatives
Compare M7A3P1000-FGG484II with alternatives