M74HCU04B1N vs GD74HCU04J feature comparison

M74HCU04B1N STMicroelectronics

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GD74HCU04J LG Semicon Co Ltd

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer STMICROELECTRONICS LG SEMICON CO LTD
Part Package Code DIP
Package Description DIP, DIP, DIP14,.3
Pin Count 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH
JESD-30 Code R-PDIP-T14 R-XDIP-T14
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type INVERTER INVERTER
Number of Functions 6
Number of Inputs 1
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY CERAMIC
Package Code DIP DIP
Package Equivalence Code DIP14,.3 DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 19 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.1 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm
Base Number Matches 1 2
Rohs Code No
JESD-609 Code e0
Max I(ol) 0.004 A
Prop. Delay@Nom-Sup 19 ns
Schmitt Trigger NO
Terminal Finish Tin/Lead (Sn/Pb)

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