M74HCT533-1FP
vs
HD74HCT563FPEL
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MITSUBISHI ELECTRIC CORP
RENESAS ELECTRONICS CORP
Part Package Code
SOIC
SOIC
Package Description
SOP, SOP20,.3
SOP, SOP20,.3
Pin Count
20
20
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
HCT
HCT
JESD-30 Code
R-PDSO-G20
R-PDSO-G20
JESD-609 Code
e0
Length
12.6 mm
12.6 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
BUS DRIVER
BUS DRIVER
Max I(ol)
0.024 A
0.006 A
Number of Bits
8
8
Number of Functions
1
1
Number of Ports
2
2
Number of Terminals
20
20
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
INVERTED
INVERTED
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Equivalence Code
SOP20,.3
SOP20,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Prop. Delay@Nom-Sup
29 ns
28 ns
Propagation Delay (tpd)
31 ns
28 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.1 mm
2.2 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
5.3 mm
5.5 mm
Base Number Matches
1
1
Moisture Sensitivity Level
1
Packing Method
TR
Compare M74HCT533-1FP with alternatives
Compare HD74HCT563FPEL with alternatives