M74HCT374F1
vs
MC54HCT374AJD
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SGS-ATES COMPONENTI ELECTRONICI S P A
MOTOROLA INC
Package Description
DIP, DIP20,.3
DIP,
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
R-XDIP-T20
R-CDIP-T20
JESD-609 Code
e0
e0
Logic IC Type
D FLIP-FLOP
BUS DRIVER
Number of Functions
8
1
Number of Terminals
20
20
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Output Characteristics
3-STATE
3-STATE
Package Body Material
CERAMIC
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
DIP
Package Equivalence Code
DIP20,.3
DIP20,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Finish
Tin/Lead (Sn/Pb)
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Trigger Type
POSITIVE EDGE
Base Number Matches
2
3
Pbfree Code
Part Package Code
DIP
Pin Count
20
Family
HCT
Length
24.515 mm
Load Capacitance (CL)
50 pF
Number of Bits
8
Number of Ports
2
Output Polarity
TRUE
Propagation Delay (tpd)
47 ns
Seated Height-Max
5.08 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Width
7.62 mm
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