M74HCT157B1R
vs
74HCT157NB
feature comparison
All Stats
Differences Only
Pbfree Code
Yes
Rohs Code
Yes
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
STMICROELECTRONICS
NXP SEMICONDUCTORS
Part Package Code
DIP
Package Description
DIP, DIP16,.3
DIP,
Pin Count
16
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
HCT
HCT
JESD-30 Code
R-PDIP-T16
R-PDIP-T16
JESD-609 Code
e3
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
MULTIPLEXER
MULTIPLEXER
Max I(ol)
0.004 A
Number of Functions
4
4
Number of Inputs
2
2
Number of Outputs
1
1
Number of Terminals
16
16
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-40 °C
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP16,.3
DIP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Prop. Delay@Nom-Sup
38 ns
Propagation Delay (tpd)
38 ns
56 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.1 mm
4.2 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
AUTOMOTIVE
Terminal Finish
MATTE TIN
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
7.62 mm
Base Number Matches
1
1
Length
19.025 mm
Compare M74HCT157B1R with alternatives
Compare 74HCT157NB with alternatives