M74HCT137B1R
vs
933757080652
feature comparison
All Stats
Differences Only
Pbfree Code
Yes
Rohs Code
Yes
Yes
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
STMICROELECTRONICS
NXP SEMICONDUCTORS
Part Package Code
DIP
DIP
Package Description
DIP, DIP16,.3
DIP,
Pin Count
16
16
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
ADDRESS LATCHES; 2 ENABLE INPUTS
ADDRESS LATCHES; 2 ENABLE INPUTS
Family
HCT
HCT
Input Conditioning
LATCHED
LATCHED
JESD-30 Code
R-PDIP-T16
R-PDIP-T16
JESD-609 Code
e3
Load Capacitance (CL)
50 pF
Logic IC Type
3-LINE TO 8-LINE DECODER
3-LINE TO 8-LINE DECODER
Max I(ol)
0.004 A
Number of Functions
1
1
Number of Terminals
16
16
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-40 °C
Output Polarity
INVERTED
INVERTED
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Prop. Delay@Nom-Sup
56 ns
Propagation Delay (tpd)
56 ns
57 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.1 mm
4.7 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
AUTOMOTIVE
Terminal Finish
MATTE TIN
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
7.62 mm
Base Number Matches
1
1
Length
21.6 mm
Peak Reflow Temperature (Cel)
245
Time@Peak Reflow Temperature-Max (s)
40
Compare M74HCT137B1R with alternatives
Compare 933757080652 with alternatives