M74HC4514B1R vs TC74HC4514P feature comparison

M74HC4514B1R STMicroelectronics

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TC74HC4514P Toshiba America Electronic Components

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Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer STMICROELECTRONICS TOSHIBA CORP
Part Package Code DIP DIP
Package Description PLASTIC, DIP-24 DIP,
Pin Count 24 24
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature ADDRESS LATCHES ADDRESS LATCHES
Family HC/UH HC/UH
Input Conditioning LATCHED LATCHED
JESD-30 Code R-PDIP-T24 R-PDIP-T24
Load Capacitance (CL) 50 pF
Logic IC Type 4-LINE TO 16-LINE DECODER 4-LINE TO 16-LINE DECODER
Max I(ol) 0.004 A
Number of Functions 1 1
Number of Terminals 24 24
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP24,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Packing Method TUBE
Peak Reflow Temperature (Cel) 245
Prop. Delay@Nom-Sup 56 ns
Propagation Delay (tpd) 230 ns 270 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 4.5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 15.24 mm 7.62 mm
Base Number Matches 1 1
JESD-609 Code e0
Length 29.59 mm
Seated Height-Max 5 mm
Terminal Finish Tin/Lead (Sn/Pb)

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