M74HC238B1R vs 5962-8688401EA feature comparison

M74HC238B1R STMicroelectronics

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5962-8688401EA Intersil Corporation

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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer STMICROELECTRONICS INTERSIL CORP
Part Package Code DIP DIP
Package Description DIP, DIP16,.3 ,
Pin Count 16 16
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer STMicroelectronics
Additional Feature 3 ENABLE INPUTS 2 ENABLE INPUTS
Family HC/UH HCT
Input Conditioning STANDARD STANDARD
JESD-30 Code R-PDIP-T16 R-GDIP-T16
JESD-609 Code e4 e0
Load Capacitance (CL) 50 pF
Logic IC Type 3-LINE TO 8-LINE DECODER 3-LINE TO 8-LINE DECODER
Max I(ol) 0.004 A
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Packing Method TUBE
Prop. Delay@Nom-Sup 45 ns
Propagation Delay (tpd) 225 ns 270 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.1 mm
Supply Voltage-Max (Vsup) 6 V 5.5 V
Supply Voltage-Min (Vsup) 2 V 4.5 V
Supply Voltage-Nom (Vsup) 4.5 V 4.5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish NICKEL PALLADIUM GOLD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm
Base Number Matches 1 4
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare M74HC238B1R with alternatives

Compare 5962-8688401EA with alternatives