M74HC237B1R vs MC74LCX139MEL feature comparison

M74HC237B1R STMicroelectronics

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MC74LCX139MEL onsemi

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer STMICROELECTRONICS ON SEMICONDUCTOR
Part Package Code DIP SOIC
Package Description DIP, DIP16,.3 SOP, SOP16,.3
Pin Count 16 16
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer STMicroelectronics
Additional Feature ADDRESS LATCHES; 2 ENABLE INPUTS
Family HC/UH LVC/LCX/Z
Input Conditioning STANDARD STANDARD
JESD-30 Code R-PDIP-T16 R-PDSO-G16
JESD-609 Code e3 e4
Load Capacitance (CL) 50 pF
Logic IC Type 3-LINE TO 8-LINE DECODER 2-LINE TO 4-LINE DECODER
Max I(ol) 0.004 A 0.024 A
Number of Functions 1 2
Number of Terminals 16 16
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Output Polarity TRUE INVERTED
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP16,.3 SOP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Packing Method TUBE TR
Prop. Delay@Nom-Sup 54 ns 6.2 ns
Propagation Delay (tpd) 270 ns 9.3 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.1 mm 2.05 mm
Supply Voltage-Max (Vsup) 6 V 3.6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 2.7 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish MATTE TIN NICKEL PALLADIUM GOLD
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Width 7.62 mm 5.275 mm
Base Number Matches 1 2
Length 10.2 mm
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 260
Power Supply Current-Max (ICC) 0.01 mA

Compare M74HC237B1R with alternatives

Compare MC74LCX139MEL with alternatives