M74HC158M1R vs HD74HC158RPEL feature comparison

M74HC158M1R STMicroelectronics

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HD74HC158RPEL Renesas Electronics Corporation

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Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer STMICROELECTRONICS RENESAS ELECTRONICS CORP
Part Package Code SOIC SOIC
Package Description SOP, SOP16,.25 SOP, SOP16,.25
Pin Count 16 16
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G16 R-PDSO-G16
JESD-609 Code e4
Length 9.9 mm 9.9 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type MULTIPLEXER MULTIPLEXER
Max I(ol) 0.004 A 0.004 A
Moisture Sensitivity Level 3 1
Number of Functions 4 4
Number of Inputs 2 2
Number of Outputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Output Polarity INVERTED INVERTED
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP16,.25 SOP16,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Prop. Delay@Nom-Sup 30 ns 28 ns
Propagation Delay (tpd) 150 ns 140 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 1.75 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 4.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish NICKEL PALLADIUM GOLD
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 3.9 mm 3.95 mm
Base Number Matches 1 1
Packing Method TR

Compare M74HC158M1R with alternatives

Compare HD74HC158RPEL with alternatives