M74HC138M1
vs
HD74HC138RPEL
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
STMICROELECTRONICS
RENESAS ELECTRONICS CORP
Part Package Code
SOIC
SOIC
Package Description
SOP, SOP16,.25
SOP, SOP16,.25
Pin Count
16
16
Reach Compliance Code
not_compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
3 ENABLE INPUTS
Family
HC/UH
HC/UH
Input Conditioning
STANDARD
STANDARD
JESD-30 Code
R-PDSO-G16
R-PDSO-G16
JESD-609 Code
e0
Length
9.9 mm
9.9 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
3-LINE TO 8-LINE DECODER
3-LINE TO 8-LINE DECODER
Max I(ol)
0.004 A
0.004 A
Number of Functions
1
1
Number of Terminals
16
16
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Polarity
INVERTED
INVERTED
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Equivalence Code
SOP16,.25
SOP16,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Prop. Delay@Nom-Sup
41 ns
44 ns
Propagation Delay (tpd)
205 ns
220 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.75 mm
1.75 mm
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
4.5 V
4.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
3.9 mm
3.95 mm
Base Number Matches
1
1
Pbfree Code
Moisture Sensitivity Level
1
Packing Method
TR
Peak Reflow Temperature (Cel)
260
Time@Peak Reflow Temperature-Max (s)
20
Compare M74HC138M1 with alternatives
Compare HD74HC138RPEL with alternatives