M74HC137F1 vs CD54HC139F feature comparison

M74HC137F1 STMicroelectronics

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CD54HC139F General Electric Solid State

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Rohs Code No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer STMICROELECTRONICS GENERAL ELECTRIC SOLID STATE
Part Package Code DIP
Package Description DIP, DIP16,.3 ,
Pin Count 16
Reach Compliance Code not_compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature ADDRESS LATCHES; 2 ENABLE INPUTS
Family HC/UH
Input Conditioning STANDARD
JESD-30 Code R-GDIP-T16
JESD-609 Code e0
Load Capacitance (CL) 50 pF
Logic IC Type 3-LINE TO 8-LINE DECODER
Max I(ol) 0.004 A
Number of Functions 1
Number of Terminals 16
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Output Polarity INVERTED
Package Body Material CERAMIC, GLASS-SEALED
Package Code DIP
Package Equivalence Code DIP16,.3
Package Shape RECTANGULAR
Package Style IN-LINE
Prop. Delay@Nom-Sup 55 ns
Propagation Delay (tpd) 49 ns
Qualification Status Not Qualified
Seated Height-Max 5 mm
Supply Voltage-Max (Vsup) 6 V
Supply Voltage-Min (Vsup) 2 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 7.62 mm
Base Number Matches 2 6

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