M5M5408P-55 vs KM684000BLGI-5L0 feature comparison

M5M5408P-55 Mitsubishi Electric

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KM684000BLGI-5L0 Samsung Semiconductor

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MITSUBISHI ELECTRIC CORP SAMSUNG SEMICONDUCTOR INC
Part Package Code DIP SOIC
Package Description DIP, DIP32,.6 SOP,
Pin Count 32 32
Reach Compliance Code unknown unknown
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 55 ns 55 ns
I/O Type COMMON
JESD-30 Code R-PDIP-T32 R-PDSO-G32
JESD-609 Code e0
Memory Density 4194304 bit 4194304 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Ports 1
Number of Terminals 32 32
Number of Words 524288 words 524288 words
Number of Words Code 512000 512000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 512KX8 512KX8
Output Characteristics 3-STATE
Output Enable YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP32,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Standby Current-Max 0.002 A
Standby Voltage-Min 2 V
Supply Current-Max 0.07 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Base Number Matches 3 1
Length 20.47 mm
Seated Height-Max 3 mm
Width 11.43 mm

Compare M5M5408P-55 with alternatives

Compare KM684000BLGI-5L0 with alternatives