M5M5256DFP-70LLI
vs
K6X0808C1D-GF70T
feature comparison
All Stats
Differences Only
Rohs Code
Yes
No
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
RENESAS TECHNOLOGY CORP
SAMSUNG SEMICONDUCTOR INC
Part Package Code
SOIC
Package Description
SOP, SOP28,.5
SOP, SOP28,.45
Pin Count
28
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
70 ns
70 ns
I/O Type
COMMON
COMMON
JESD-30 Code
R-PDSO-G28
R-PDSO-G28
Length
17.5 mm
Memory Density
262144 bit
262144 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
8
8
Moisture Sensitivity Level
2
1
Number of Functions
1
Number of Terminals
28
28
Number of Words
32768 words
32768 words
Number of Words Code
32000
32000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
32KX8
32KX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Equivalence Code
SOP28,.5
SOP28,.45
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.4 mm
Standby Voltage-Min
2 V
2 V
Supply Current-Max
0.045 mA
0.025 mA
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
8.4 mm
Base Number Matches
1
1
Pbfree Code
No
Standby Current-Max
0.00001 A
Compare M5M5256DFP-70LLI with alternatives
Compare K6X0808C1D-GF70T with alternatives