M5M51008DFP-70H
vs
EDI88128CS35TM
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
RENESAS ELECTRONICS CORP
MICROSEMI CORP
Part Package Code
SOIC
DIP
Package Description
0.525 INCH, SOP-32
0.400 INCH, SIDE BRAZED, CERAMIC, DIP-32
Pin Count
32
32
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
3A001.A.2.C
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
70 ns
35 ns
I/O Type
COMMON
JESD-30 Code
R-PDSO-G32
R-CDIP-T32
Length
20.75 mm
40.64 mm
Memory Density
1048576 bit
1048576 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
8
8
Moisture Sensitivity Level
2
Number of Functions
1
1
Number of Terminals
32
32
Number of Words
131072 words
131072 words
Number of Words Code
128000
128000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-55 °C
Organization
128KX8
128KX8
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
CERAMIC, METAL-SEALED COFIRED
Package Code
SOP
DIP
Package Equivalence Code
SOP32,.56
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
260
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.05 mm
3.937 mm
Standby Voltage-Min
2 V
Supply Current-Max
0.07 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
MILITARY
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
20
NOT SPECIFIED
Width
11.4 mm
10.16 mm
Base Number Matches
2
5
Pbfree Code
Compare M5M51008DFP-70H with alternatives
Compare EDI88128CS35TM with alternatives