M58WR032QT60ZB6T vs M58WR032QT60ZB6E feature comparison

M58WR032QT60ZB6T Micron Technology Inc

Buy Now Datasheet

M58WR032QT60ZB6E Micron Technology Inc

Buy Now Datasheet
Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICRON TECHNOLOGY INC MICRON TECHNOLOGY INC
Package Description FBGA, BGA56,7X8,30 FBGA, BGA56,7X8,30
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 60 ns 60 ns
Boot Block TOP TOP
Command User Interface YES YES
Common Flash Interface YES YES
Data Polling NO NO
JESD-30 Code R-PBGA-B56 R-PBGA-B56
Memory Density 33554432 bit 33554432 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Number of Sectors/Size 8,63 8,63
Number of Terminals 56 56
Number of Words 2097152 words 2097152 words
Number of Words Code 2000000 2000000
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 2MX16 2MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code FBGA FBGA
Package Equivalence Code BGA56,7X8,30 BGA56,7X8,30
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, FINE PITCH GRID ARRAY, FINE PITCH
Page Size 4 words 4 words
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Sector Size 4K,32K 4K,32K
Standby Current-Max 0.00005 A 0.00005 A
Supply Current-Max 0.045 mA 0.045 mA
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form BALL BALL
Terminal Pitch 0.75 mm 0.75 mm
Terminal Position BOTTOM BOTTOM
Toggle Bit NO NO
Type NOR TYPE NOR TYPE
Base Number Matches 3 3