M58WR032HB60ZB6E
vs
PH28F320W18BD60
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NUMONYX
MICRON TECHNOLOGY INC
Part Package Code
BGA
BGA
Package Description
7.70 X 9 MM, 0.75 MM PITCH, LEAD FREE, VFBGA-56
VFBGA,
Pin Count
56
56
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
60 ns
60 ns
Additional Feature
100,000 PROGRAM/ERASE CYCLES; SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE
SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE
Boot Block
BOTTOM
BOTTOM
JESD-30 Code
R-PBGA-B56
R-PBGA-B56
JESD-609 Code
e1
e1
Length
9 mm
9 mm
Memory Density
33554432 bit
33554432 bit
Memory IC Type
FLASH
FLASH
Memory Width
16
16
Number of Functions
1
1
Number of Terminals
56
56
Number of Words
2097152 words
2097152 words
Number of Words Code
2000000
2000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
2MX16
2MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
VFBGA
VFBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
260
Programming Voltage
1.8 V
1.8 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1 mm
1 mm
Supply Voltage-Max (Vsup)
2 V
1.95 V
Supply Voltage-Min (Vsup)
1.7 V
1.7 V
Supply Voltage-Nom (Vsup)
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN SILVER COPPER
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
0.75 mm
0.75 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
40
Type
NOR TYPE
NOR TYPE
Width
7.7 mm
7.7 mm
Base Number Matches
2
3
Pbfree Code
Rohs Code
Compare M58WR032HB60ZB6E with alternatives
Compare PH28F320W18BD60 with alternatives