M58WR032FT60ZB6
vs
M58WR032QT60ZB6E
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
STMICROELECTRONICS
MICRON TECHNOLOGY INC
Part Package Code
BGA
Package Description
7.70 X 9 MM, 0.75 MM PITCH, VFBGA-56
FBGA, BGA56,7X8,30
Pin Count
56
Reach Compliance Code
not_compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
60 ns
60 ns
Additional Feature
SYNCHRONOUS BURST MODE OPERATION POSSIBLE
Boot Block
TOP
TOP
Command User Interface
YES
YES
Common Flash Interface
YES
YES
Data Polling
NO
NO
JESD-30 Code
R-PBGA-B56
R-PBGA-B56
JESD-609 Code
e0
Length
9 mm
Memory Density
33554432 bit
33554432 bit
Memory IC Type
FLASH
FLASH
Memory Width
16
16
Number of Functions
1
Number of Sectors/Size
8,63
8,63
Number of Terminals
56
56
Number of Words
2097152 words
2097152 words
Number of Words Code
2000000
2000000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
2MX16
2MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
VFBGA
FBGA
Package Equivalence Code
BGA56,7X8,30
BGA56,7X8,30
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
GRID ARRAY, FINE PITCH
Page Size
4 words
4 words
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
1.8 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1 mm
Sector Size
4K,32K
4K,32K
Standby Current-Max
0.000005 A
0.00005 A
Supply Current-Max
0.045 mA
0.045 mA
Supply Voltage-Max (Vsup)
2 V
Supply Voltage-Min (Vsup)
1.7 V
Supply Voltage-Nom (Vsup)
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
0.75 mm
0.75 mm
Terminal Position
BOTTOM
BOTTOM
Toggle Bit
NO
NO
Type
NOR TYPE
NOR TYPE
Width
7.7 mm
Base Number Matches
2
3
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