We use Cookies to give you best experience on our website. By using our website and services, you expressly agree to the placement of our performance, functionality and advertising cookies. Please see our Privacy Policy for more information.

Register or Sign In

M58WR032FB60ZB6F vs PH28F320W18BC60 feature comparison

M58WR032FB60ZB6F STMicroelectronics

Buy Now Datasheet

PH28F320W18BC60 Intel Corporation

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer STMICROELECTRONICS INTEL CORP
Part Package Code BGA BGA
Package Description 7.70 X 9 MM, 0.75 MM PITCH, LEAD FREE, VFBGA-56 0.75 MM PITCH, LEAD FREE, VFBGA-56
Pin Count 56 56
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 60 ns 60 ns
Additional Feature SYNCHRONOUS BURST MODE OPERATION POSSIBLE SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE
Boot Block BOTTOM BOTTOM
Command User Interface YES
Common Flash Interface YES
Data Polling NO
JESD-30 Code R-PBGA-B56 R-PBGA-B56
JESD-609 Code e1 e1
Length 9 mm 9 mm
Memory Density 33554432 bit 33554432 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Number of Functions 1 1
Number of Sectors/Size 8,63
Number of Terminals 56 56
Number of Words 2097152 words 2097152 words
Number of Words Code 2000000 2000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 2MX16 2MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VFBGA VFBGA
Package Equivalence Code BGA56,7X8,30
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Page Size 4 words
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 1.8 V 1.8 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1 mm 1 mm
Sector Size 4K,32K
Standby Current-Max 0.000005 A
Supply Current-Max 0.045 mA
Supply Voltage-Max (Vsup) 2 V 1.95 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN SILVER COPPER Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL BALL
Terminal Pitch 0.75 mm 0.75 mm
Terminal Position BOTTOM BOTTOM
Toggle Bit NO
Type NOR TYPE NOR TYPE
Width 7.7 mm 7.7 mm
Base Number Matches 1 1
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 40
Memory » Flash Memories
Memory » Flash Memories

Compare M58WR032FB60ZB6F with alternatives

Compare PH28F320W18BC60 with alternatives