M58LW128H115ZA1F
vs
S29PL127J65BFW000
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
STMICROELECTRONICS
|
SPANSION INC
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
10 X 13 MM, 1 MM PITCH, LEAD FREE, TBGA-64
|
11 X 8 MM, LEAD FREE, FBGA-80
|
| Pin Count |
64
|
80
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Access Time-Max |
115 ns
|
65 ns
|
| Additional Feature |
SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE
|
|
| Command User Interface |
YES
|
YES
|
| Common Flash Interface |
YES
|
YES
|
| Data Polling |
NO
|
YES
|
| JESD-30 Code |
R-PBGA-B64
|
R-PBGA-B80
|
| Length |
13 mm
|
11 mm
|
| Memory Density |
134217728 bit
|
134217728 bit
|
| Memory IC Type |
FLASH
|
FLASH
|
| Memory Width |
16
|
16
|
| Number of Functions |
1
|
1
|
| Number of Sectors/Size |
128
|
16,254
|
| Number of Terminals |
64
|
80
|
| Number of Words |
8388608 words
|
8388608 words
|
| Number of Words Code |
8000000
|
8000000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-25 °C
|
| Organization |
8MX16
|
8MX16
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TBGA
|
VFBGA
|
| Package Equivalence Code |
BGA64,8X8,40
|
BGA80,8X12,32
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, THIN PROFILE
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
| Page Size |
8 words
|
8 words
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Programming Voltage |
3 V
|
3 V
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.2 mm
|
1 mm
|
| Sector Size |
64K
|
4K,32K
|
| Standby Current-Max |
0.00004 A
|
0.000005 A
|
| Supply Current-Max |
0.03 mA
|
0.07 mA
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
2.7 V
|
2.7 V
|
| Supply Voltage-Nom (Vsup) |
3 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
OTHER
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
0.8 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
40
|
| Toggle Bit |
NO
|
YES
|
| Type |
NOR TYPE
|
NOR TYPE
|
| Width |
10 mm
|
8 mm
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| Boot Block |
|
BOTTOM/TOP
|
| JESD-609 Code |
|
e1
|
| Moisture Sensitivity Level |
|
3
|
| Ready/Busy |
|
YES
|
| Terminal Finish |
|
TIN SILVER COPPER
|
|
|
|
Compare M58LW128H115ZA1F with alternatives
Compare S29PL127J65BFW000 with alternatives