M58CR064D200ZB6
vs
M58CR064P100ZB6T
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
STMICROELECTRONICS
STMICROELECTRONICS
Part Package Code
BGA
BGA
Package Description
0.75 MM PITCH, TFBGA-56
6.50 X 10 MM, 0.75 MM PITCH, TFBGA-56
Pin Count
56
56
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
200 ns
14 ns
Boot Block
BOTTOM
TOP
JESD-30 Code
R-PBGA-B56
R-PBGA-B56
Length
10 mm
10 mm
Memory Density
67108864 bit
67108864 bit
Memory IC Type
FLASH
FLASH
Memory Width
16
16
Number of Functions
1
1
Number of Terminals
56
56
Number of Words
4194304 words
4194304 words
Number of Words Code
4000000
4000000
Operating Mode
ASYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
4MX16
4MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
TFBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
1.8 V
1.8 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.2 mm
Supply Voltage-Max (Vsup)
2 V
2 V
Supply Voltage-Min (Vsup)
1.65 V
1.65 V
Supply Voltage-Nom (Vsup)
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Pitch
0.75 mm
0.75 mm
Terminal Position
BOTTOM
BOTTOM
Type
NOR TYPE
NOR TYPE
Width
6.5 mm
6.5 mm
Base Number Matches
2
2
Rohs Code
Command User Interface
YES
Common Flash Interface
YES
Data Polling
NO
JESD-609 Code
e1
Number of Sectors/Size
8,127
Package Equivalence Code
BGA56,7X8,30
Page Size
4 words
Sector Size
4K,32K
Standby Current-Max
0.000005 A
Supply Current-Max
0.03 mA
Terminal Finish
Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Toggle Bit
NO
Compare M58CR064D200ZB6 with alternatives
Compare M58CR064P100ZB6T with alternatives