M58CR064D100ZB6T
vs
M58WR128FT80ZB6T
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
NUMONYX
|
NUMONYX
|
Part Package Code |
BGA
|
BGA
|
Package Description |
TFBGA,
|
VFBGA,
|
Pin Count |
56
|
56
|
Reach Compliance Code |
unknown
|
not_compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.51
|
8542.32.00.51
|
Access Time-Max |
14 ns
|
80 ns
|
JESD-30 Code |
R-PBGA-B56
|
R-PBGA-B56
|
Length |
10 mm
|
9 mm
|
Memory Density |
67108864 bit
|
134217728 bit
|
Memory IC Type |
FLASH
|
FLASH
|
Memory Width |
16
|
16
|
Number of Functions |
1
|
1
|
Number of Terminals |
56
|
56
|
Number of Words |
4194304 words
|
8388608 words
|
Number of Words Code |
4000000
|
8000000
|
Operating Mode |
SYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Organization |
4MX16
|
8MX16
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TFBGA
|
VFBGA
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY, THIN PROFILE, FINE PITCH
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Programming Voltage |
1.8 V
|
1.8 V
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.2 mm
|
1 mm
|
Supply Voltage-Max (Vsup) |
2 V
|
2 V
|
Supply Voltage-Min (Vsup) |
1.65 V
|
1.7 V
|
Supply Voltage-Nom (Vsup) |
1.8 V
|
1.8 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.75 mm
|
0.75 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
6.5 mm
|
7.7 mm
|
Base Number Matches |
1
|
1
|
Rohs Code |
|
No
|
Additional Feature |
|
SYNCHRONOUS BURST MODE OPERATION POSSIBLE
|
Boot Block |
|
TOP
|
JESD-609 Code |
|
e0
|
Terminal Finish |
|
Tin/Lead (Sn63Pb37)
|
Type |
|
NOR TYPE
|
|
|
|
Compare M58CR064D100ZB6T with alternatives
Compare M58WR128FT80ZB6T with alternatives