M58BW016FB8ZA3FF vs M58BW016BB80ZA3 feature comparison

M58BW016FB8ZA3FF Micron Technology Inc

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M58BW016BB80ZA3 STMicroelectronics

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer MICRON TECHNOLOGY INC STMICROELECTRONICS
Part Package Code BGA BGA
Package Description LBGA, 10 X 12 MM, 1 MM PITCH, LBGA-80
Pin Count 80 80
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 80 ns 80 ns
Boot Block BOTTOM BOTTOM
JESD-30 Code R-PBGA-B80 R-PBGA-B80
Length 12 mm 12 mm
Memory Density 16777216 bit 16777216 bit
Memory IC Type FLASH FLASH
Memory Width 32 32
Number of Functions 1 1
Number of Terminals 80 80
Number of Words 524288 words 524288 words
Number of Words Code 512000 512000
Operating Mode SYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Organization 512KX32 512KX32
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 3 V 3 V
Seated Height-Max 1.6 mm 1.7 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Type NOR TYPE NOR TYPE
Width 10 mm 10 mm
Base Number Matches 1 2
Additional Feature BOTTOM BOOT BLOCK
Command User Interface YES
Common Flash Interface YES
Data Polling NO
JESD-609 Code e1
Number of Sectors/Size 8,31
Package Equivalence Code BGA80,8X10,40
Qualification Status Not Qualified
Sector Size 2K,16K
Standby Current-Max 0.000005 A
Supply Current-Max 0.03 mA
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Toggle Bit NO

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