M58BW016DTXXZA3T
vs
S29CD016J1MFAM130
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
STMICROELECTRONICS
SPANSION INC
Part Package Code
BGA
BGA
Package Description
1 MM PITCH, LBGA-80
LBGA,
Pin Count
80
80
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
80 ns
54 ns
Additional Feature
TOP BOOT BLOCK
TOP BOOT BLOCK
Boot Block
TOP
BOTTOM
JESD-30 Code
R-PBGA-B80
R-PBGA-B80
Length
12 mm
13 mm
Memory Density
16777216 bit
16777216 bit
Memory IC Type
FLASH
FLASH
Memory Width
32
32
Number of Functions
1
1
Number of Terminals
80
80
Number of Words
524288 words
524288 words
Number of Words Code
512000
512000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
512KX32
512KX32
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
3 V
2.7 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.7 mm
1.4 mm
Supply Voltage-Max (Vsup)
3.6 V
2.75 V
Supply Voltage-Min (Vsup)
2.7 V
2.5 V
Supply Voltage-Nom (Vsup)
3 V
2.6 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Type
NOR TYPE
NOR TYPE
Width
10 mm
11 mm
Base Number Matches
1
1
Pbfree Code
Rohs Code
JESD-609 Code
e0
Moisture Sensitivity Level
3
Terminal Finish
TIN LEAD
Compare M58BW016DTXXZA3T with alternatives
Compare S29CD016J1MFAM130 with alternatives