M58BW016DT8ZA3FT vs M58BW016FT8ZA3FT feature comparison

M58BW016DT8ZA3FT Micron Technology Inc

Buy Now Datasheet

M58BW016FT8ZA3FT Micron Technology Inc

Buy Now Datasheet
Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICRON TECHNOLOGY INC MICRON TECHNOLOGY INC
Part Package Code BGA BGA
Package Description LBGA-80 12 X 10 MM, LBGA-80
Pin Count 80 80
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 80 ns 80 ns
Boot Block TOP TOP
Command User Interface YES
Common Flash Interface YES
Data Polling NO
JESD-30 Code R-PBGA-B80 R-PBGA-B80
Length 12 mm 12 mm
Memory Density 16777216 bit 16777216 bit
Memory IC Type FLASH FLASH
Memory Width 32 32
Number of Functions 1 1
Number of Sectors/Size 8,31
Number of Terminals 80 80
Number of Words 524288 words 524288 words
Number of Words Code 512000 512000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Organization 512KX32 512KX32
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA80,8X10,40
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 3 V 3 V
Qualification Status Not Qualified
Screening Level AEC-Q100
Seated Height-Max 1.6 mm 1.6 mm
Sector Size 2K,16K
Standby Current-Max 0.000005 A
Supply Current-Max 0.03 mA
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Toggle Bit NO
Type NOR TYPE NOR TYPE
Width 10 mm 10 mm
Base Number Matches 1 1

Compare M58BW016DT8ZA3FT with alternatives

Compare M58BW016FT8ZA3FT with alternatives