M58BW016DB80ZA6T
vs
M58BW016DB8ZA3FF
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
STMICROELECTRONICS
STMICROELECTRONICS
Part Package Code
BGA
Package Description
10 X 12 MM, 1 MM PITCH, LBGA-80
Pin Count
80
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
80 ns
Additional Feature
BOTTOM BOOT BLOCK
Boot Block
BOTTOM
Command User Interface
YES
Common Flash Interface
YES
Data Polling
NO
JESD-30 Code
R-PBGA-B80
JESD-609 Code
e1
Length
12 mm
Memory Density
16777216 bit
Memory IC Type
FLASH
Memory Width
32
Number of Functions
1
Number of Sectors/Size
8,31
Number of Terminals
80
Number of Words
524288 words
Number of Words Code
512000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Organization
512KX32
Package Body Material
PLASTIC/EPOXY
Package Code
LBGA
Package Equivalence Code
BGA80,8X10,40
Package Shape
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE
Parallel/Serial
PARALLEL
Programming Voltage
3 V
Qualification Status
Not Qualified
Seated Height-Max
1.7 mm
Sector Size
2K,16K
Standby Current-Max
0.000005 A
Supply Current-Max
0.03 mA
Supply Voltage-Max (Vsup)
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
Supply Voltage-Nom (Vsup)
3 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
INDUSTRIAL
Terminal Finish
Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form
BALL
Terminal Pitch
1 mm
Terminal Position
BOTTOM
Toggle Bit
NO
Type
NOR TYPE
Width
10 mm
Base Number Matches
2
3
Compare M58BW016DB80ZA6T with alternatives