M58BW016BB100T3FT
vs
S29CL016J0JFFM022
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
STMICROELECTRONICS
|
SPANSION INC
|
| Part Package Code |
QFP
|
BGA
|
| Package Description |
PLASTIC, QFP-80
|
LBGA, BGA80,8X10,40
|
| Pin Count |
80
|
80
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Access Time-Max |
100 ns
|
54 ns
|
| Additional Feature |
SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; BOTTOM BOOT BLOCK
|
SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; TOP BOOT BLOCK
|
| Boot Block |
BOTTOM
|
TOP
|
| Command User Interface |
YES
|
YES
|
| Common Flash Interface |
YES
|
YES
|
| Data Polling |
NO
|
YES
|
| JESD-30 Code |
R-PQFP-G80
|
R-PBGA-B80
|
| JESD-609 Code |
e0
|
e1
|
| Length |
20 mm
|
13 mm
|
| Memory Density |
16777216 bit
|
16777216 bit
|
| Memory IC Type |
FLASH
|
FLASH
|
| Memory Width |
32
|
32
|
| Number of Functions |
1
|
1
|
| Number of Sectors/Size |
8,31
|
16,30
|
| Number of Terminals |
80
|
80
|
| Number of Words |
524288 words
|
524288 words
|
| Number of Words Code |
512000
|
512000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
512KX32
|
512KX32
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QFP
|
LBGA
|
| Package Equivalence Code |
QFP80,.7X.9,32
|
BGA80,8X10,40
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
FLATPACK
|
GRID ARRAY, LOW PROFILE
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Programming Voltage |
3 V
|
3.3 V
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
3.4 mm
|
1.4 mm
|
| Sector Size |
2K,16K
|
2K,16K
|
| Standby Current-Max |
0.000005 A
|
0.00006 A
|
| Supply Current-Max |
0.03 mA
|
0.09 mA
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
2.7 V
|
3 V
|
| Supply Voltage-Nom (Vsup) |
3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Finish |
TIN LEAD
|
TIN SILVER COPPER
|
| Terminal Form |
GULL WING
|
BALL
|
| Terminal Pitch |
0.8 mm
|
1 mm
|
| Terminal Position |
QUAD
|
BOTTOM
|
| Toggle Bit |
NO
|
YES
|
| Type |
NOR TYPE
|
NOR TYPE
|
| Width |
14 mm
|
11 mm
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| Moisture Sensitivity Level |
|
3
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Ready/Busy |
|
YES
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
Compare M58BW016BB100T3FT with alternatives
Compare S29CL016J0JFFM022 with alternatives