M55342M12W309DS-W
vs
M55342M12B309DM
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
STATE OF THE ART INC
|
TT ELECTRONICS PLC
|
| Package Description |
CHIP
|
SMT, 0603
|
| Reach Compliance Code |
compliant
|
compliant
|
| Construction |
Chip
|
Rectangular
|
| JESD-609 Code |
e4
|
e0
|
| Mounting Feature |
SURFACE MOUNT
|
SURFACE MOUNT
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
150 °C
|
150 °C
|
| Operating Temperature-Min |
-65 °C
|
|
| Package Height |
0.46 mm
|
0.508 mm
|
| Package Length |
1.58 mm
|
1.6002 mm
|
| Package Shape |
RECTANGULAR PACKAGE
|
|
| Package Style |
SMT
|
SMT
|
| Package Width |
0.81 mm
|
0.7874 mm
|
| Packing Method |
WAFFLE PACK
|
TR, PLASTIC
|
| Rated Power Dissipation (P) |
0.1 W
|
0.1 W
|
| Rated Temperature |
70 °C
|
70 °C
|
| Reference Standard |
MIL-PRF-55342
|
MIL-PRF-55342
|
| Resistance |
309 Ω
|
309 Ω
|
| Resistor Type |
FIXED RESISTOR
|
FIXED RESISTOR
|
| Size Code |
0603
|
0603
|
| Surface Mount |
YES
|
YES
|
| Technology |
METAL GLAZE/THICK FILM
|
THIN FILM
|
| Temperature Coefficient |
300 ppm/°C
|
300 ppm/°C
|
| Terminal Finish |
Gold (Au)
|
Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier
|
| Terminal Shape |
WRAPAROUND
|
WRAPAROUND
|
| Tolerance |
1%
|
1%
|
| Working Voltage |
50 V
|
50 V
|
| Base Number Matches |
1
|
3
|
| Pbfree Code |
|
No
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8533.21.00.30
|
| Additional Feature |
|
PRECISION
|
|
|
|
Compare M55342M12W309DS-W with alternatives
Compare M55342M12B309DM with alternatives