M55342K08B221DP
vs
M55342K08U221DP
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
TT ELECTRONICS PLC
|
STATE OF THE ART INC
|
| Package Description |
CHIP
|
CHIP
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8533.21.00
|
8533.21.00.30
|
| Additional Feature |
PRECISION
|
|
| Construction |
Chip
|
|
| JESD-609 Code |
e0
|
e4
|
| Mounting Feature |
SURFACE MOUNT
|
SURFACE MOUNT
|
| Number of Terminals |
2
|
2
|
| Package Height |
0.711 mm
|
|
| Package Length |
5.308 mm
|
|
| Package Shape |
RECTANGULAR PACKAGE
|
RECTANGULAR PACKAGE
|
| Package Style |
SMT
|
|
| Package Width |
2.489 mm
|
|
| Packing Method |
TAPE
|
|
| Rated Power Dissipation (P) |
0.8 W
|
0.8 W
|
| Reference Standard |
MIL-PRF-55342
|
MIL-PRF-55342
|
| Resistance |
221 Ω
|
221 Ω
|
| Resistor Type |
FIXED RESISTOR
|
FIXED RESISTOR
|
| Series |
TMC(MILITARY)
|
|
| Size Code |
2010
|
2010
|
| Surface Mount |
YES
|
YES
|
| Technology |
METAL GLAZE/THICK FILM
|
METAL GLAZE/THICK FILM
|
| Temperature Coefficient |
100 ppm/°C
|
100 ppm/°C
|
| Terminal Finish |
Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier
|
Platinum/Gold (Pt/Au)
|
| Terminal Shape |
WRAPAROUND
|
WRAPAROUND
|
| Tolerance |
1%
|
1%
|
| Working Voltage |
150 V
|
150 V
|
| Base Number Matches |
3
|
1
|
| Operating Temperature-Max |
|
150 °C
|
| Rated Temperature |
|
70 °C
|
|
|
|
Compare M55342K08U221DP with alternatives