Findchips: Compare M54HCT157F1R vs TC74HCT157AP

M54HCT157F1R vs TC74HCT157AP feature comparison

Buy Now Datasheet

Buy Now Datasheet

Pbfree Code	No
Rohs Code	No	Yes
Part Life Cycle Code	Obsolete	Obsolete
Ihs Manufacturer	STMICROELECTRONICS	TOSHIBA CORP
Part Package Code	DIP	DIP
Package Description	DIP, DIP16,.3	DIP, DIP16,.3
Pin Count	16	16
Reach Compliance Code	not_compliant	unknown
HTS Code	8542.39.00.01	8542.39.00.01
Family	HCT	HCT
JESD-30 Code	R-GDIP-T16	R-PDIP-T16
JESD-609 Code	e0
Length	19.304 mm	19.25 mm
Load Capacitance (CL)	50 pF	50 pF
Logic IC Type	MULTIPLEXER	MULTIPLEXER
Max I(ol)	0.004 A	0.004 A
Number of Functions	4	4
Number of Inputs	2	2
Number of Outputs	1	1
Number of Terminals	16	16
Operating Temperature-Max	125 °C	85 °C
Operating Temperature-Min	-55 °C	-40 °C
Output Polarity	TRUE	TRUE
Package Body Material	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY
Package Code	DIP	DIP
Package Equivalence Code	DIP16,.3	DIP16,.3
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	IN-LINE	IN-LINE
Prop. Delay@Nom-Sup	38 ns	44 ns
Propagation Delay (tpd)	45 ns	44 ns
Qualification Status	Not Qualified	Not Qualified
Seated Height-Max	5.08 mm	4.45 mm
Supply Voltage-Max (Vsup)	5.5 V	5.5 V
Supply Voltage-Min (Vsup)	4.5 V	4.5 V
Supply Voltage-Nom (Vsup)	5 V	5 V
Surface Mount	NO	NO
Technology	CMOS	CMOS
Temperature Grade	MILITARY	INDUSTRIAL
Terminal Finish	TIN LEAD
Terminal Form	THROUGH-HOLE	THROUGH-HOLE
Terminal Pitch	2.54 mm	2.54 mm
Terminal Position	DUAL	DUAL
Width	7.62 mm	7.62 mm
Base Number Matches	1	1
Peak Reflow Temperature (Cel)		NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)		NOT SPECIFIED
	Logic » Multiplexer/Demultiplexers	Logic » Multiplexer/Demultiplexers