M54HCT138F1
vs
MC74HCT138ADR2G
feature comparison
All Stats
Differences Only
Rohs Code
No
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
STMICROELECTRONICS
ONSEMI
Part Package Code
DIP
SOIC 16 LEAD
Package Description
DIP, DIP16,.3
SOIC-16
Pin Count
16
16
Reach Compliance Code
not_compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
3 ENABLE INPUTS
Family
HCT
HCT
Input Conditioning
STANDARD
STANDARD
JESD-30 Code
R-GDIP-T16
R-PDSO-G16
JESD-609 Code
e0
e3
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
3-LINE TO 8-LINE DECODER
3-LINE TO 8-LINE DECODER
Max I(ol)
0.004 A
0.004 A
Number of Functions
1
1
Number of Terminals
16
16
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Output Polarity
INVERTED
INVERTED
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
DIP
SOP
Package Equivalence Code
DIP16,.3
SOP16,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE
Prop. Delay@Nom-Sup
75 ns
45 ns
Propagation Delay (tpd)
75 ns
45 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5 mm
1.75 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
MATTE TIN
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
3.9 mm
Base Number Matches
2
1
Pbfree Code
Yes
Manufacturer Package Code
751B-05
Factory Lead Time
12 Weeks
Samacsys Manufacturer
onsemi
Length
9.9 mm
Moisture Sensitivity Level
1
Packing Method
TR
Peak Reflow Temperature (Cel)
260
Time@Peak Reflow Temperature-Max (s)
30
Compare M54HCT138F1 with alternatives
Compare MC74HCT138ADR2G with alternatives