M54HCT138F1 vs MC74HCT138ADR2G feature comparison

M54HCT138F1 STMicroelectronics

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MC74HCT138ADR2G onsemi

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Rohs Code No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer STMICROELECTRONICS ONSEMI
Part Package Code DIP SOIC 16 LEAD
Package Description DIP, DIP16,.3 SOIC-16
Pin Count 16 16
Reach Compliance Code not_compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature 3 ENABLE INPUTS
Family HCT HCT
Input Conditioning STANDARD STANDARD
JESD-30 Code R-GDIP-T16 R-PDSO-G16
JESD-609 Code e0 e3
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type 3-LINE TO 8-LINE DECODER 3-LINE TO 8-LINE DECODER
Max I(ol) 0.004 A 0.004 A
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Output Polarity INVERTED INVERTED
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP16,.3 SOP16,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Prop. Delay@Nom-Sup 75 ns 45 ns
Propagation Delay (tpd) 75 ns 45 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5 mm 1.75 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish TIN LEAD MATTE TIN
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Width 7.62 mm 3.9 mm
Base Number Matches 2 1
Pbfree Code Yes
Manufacturer Package Code 751B-05
Factory Lead Time 12 Weeks
Samacsys Manufacturer onsemi
Length 9.9 mm
Moisture Sensitivity Level 1
Packing Method TR
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30

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