M54HC75D1
vs
GD54HC175
feature comparison
All Stats
Differences Only
Pbfree Code
No
Rohs Code
No
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
STMICROELECTRONICS
GOLDSTAR ELECTRON CO LTD
Part Package Code
DIP
Package Description
DIP, DIP16,.3
,
Pin Count
16
Reach Compliance Code
not_compliant
unknown
HTS Code
8542.39.00.01
Family
HC/UH
HC/UH
JESD-30 Code
R-CDIP-T16
R-PDIP-T16
JESD-609 Code
e0
Length
20.32 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
D LATCH
D FLIP-FLOP
Max I(ol)
0.004 A
Number of Bits
2
4
Number of Functions
2
1
Number of Terminals
16
16
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Output Polarity
COMPLEMENTARY
COMPLEMENTARY
Package Body Material
CERAMIC, METAL-SEALED COFIRED
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Prop. Delay@Nom-Sup
33 ns
Propagation Delay (tpd)
190 ns
50 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.83 mm
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
4.5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
DUAL
Total Dose
50k Rad(Si) V
Trigger Type
HIGH LEVEL
POSITIVE EDGE
Width
7.62 mm
Base Number Matches
1
1
fmax-Min
20 MHz
Compare M54HC75D1 with alternatives
Compare GD54HC175 with alternatives