M54HC4060K
vs
74HC4060D-Q100
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
STMICROELECTRONICS
|
NXP SEMICONDUCTORS
|
| Part Package Code |
DFP
|
SOIC
|
| Package Description |
DFP, FL16,.3
|
SOP, SOP16,.25
|
| Pin Count |
16
|
16
|
| Reach Compliance Code |
not_compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Count Direction |
UP
|
UP
|
| Family |
HC/UH
|
HC/UH
|
| JESD-30 Code |
R-CDFP-F16
|
R-PDSO-G16
|
| JESD-609 Code |
e0
|
|
| Length |
9.94 mm
|
9.9 mm
|
| Load Capacitance (CL) |
50 pF
|
50 pF
|
| Load/Preset Input |
NO
|
NO
|
| Logic IC Type |
BINARY COUNTER
|
BINARY COUNTER
|
| Max Frequency@Nom-Sup |
20000000 Hz
|
24000000 Hz
|
| Max I(ol) |
0.004 A
|
0.004 A
|
| Mode of Operation |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Number of Bits |
14
|
14
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-40 °C
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
PLASTIC/EPOXY
|
| Package Code |
DFP
|
SOP
|
| Package Equivalence Code |
FL16,.3
|
SOP16,.25
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
FLATPACK
|
SMALL OUTLINE
|
| Propagation Delay (tpd) |
450 ns
|
450 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
ESCC9000
|
AEC-Q100
|
| Seated Height-Max |
2.38 mm
|
1.75 mm
|
| Supply Voltage-Max (Vsup) |
6 V
|
6 V
|
| Supply Voltage-Min (Vsup) |
2 V
|
2 V
|
| Supply Voltage-Nom (Vsup) |
4.5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
AUTOMOTIVE
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
FLAT
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Total Dose |
50k Rad(Si) V
|
|
| Trigger Type |
NEGATIVE EDGE
|
NEGATIVE EDGE
|
| Width |
6.91 mm
|
3.9 mm
|
| fmax-Min |
24 MHz
|
24 MHz
|
| Base Number Matches |
1
|
2
|
| Moisture Sensitivity Level |
|
1
|
| Packing Method |
|
TR
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare M54HC4060K with alternatives
Compare 74HC4060D-Q100 with alternatives