M54HC4050F1R vs TC74HC4050AP feature comparison

M54HC4050F1R STMicroelectronics

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TC74HC4050AP Toshiba America Electronic Components

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Pbfree Code No
Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer STMICROELECTRONICS TOSHIBA CORP
Part Package Code DIP DIP
Package Description DIP, DIP16,.3 DIP, DIP16,.3
Pin Count 16 16
Reach Compliance Code not_compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature CMOS-TTL LEVEL TRANSLATOR
Family HC/UH HC
JESD-30 Code R-GDIP-T16 R-PDIP-T16
JESD-609 Code e0
Length 19.304 mm 19.25 mm
Load Capacitance (CL) 150 pF 150 pF
Logic IC Type BUFFER BUFFER
Max I(ol) 0.006 A 0.0078 A
Number of Functions 6 6
Number of Inputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP16,.3 DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Prop. Delay@Nom-Sup 23 ns 29 ns
Propagation Delay (tpd) 30 ns 145 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Seated Height-Max 5.08 mm 4.45 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 4.5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 1 1
Samacsys Manufacturer Toshiba
Peak Reflow Temperature (Cel) NOT SPECIFIED
Power Supply Current-Max (ICC) 75 mA
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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