M54HC237F1 vs MC74LCX139MEL feature comparison

M54HC237F1 STMicroelectronics

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MC74LCX139MEL onsemi

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer STMICROELECTRONICS ON SEMICONDUCTOR
Part Package Code DIP SOIC
Package Description DIP, DIP16,.3 SOP, SOP16,.3
Pin Count 16 16
Reach Compliance Code not_compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature ADDRESS LATCHES; 2 ENABLE INPUTS
Family HC/UH LVC/LCX/Z
Input Conditioning LATCHED STANDARD
JESD-30 Code R-GDIP-T16 R-PDSO-G16
JESD-609 Code e0 e4
Load Capacitance (CL) 50 pF
Logic IC Type 3-LINE TO 8-LINE DECODER 2-LINE TO 4-LINE DECODER
Max I(ol) 0.004 A 0.024 A
Number of Functions 1 2
Number of Terminals 16 16
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Output Polarity TRUE INVERTED
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP16,.3 SOP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Prop. Delay@Nom-Sup 60 ns 6.2 ns
Propagation Delay (tpd) 54 ns 9.3 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5 mm 2.05 mm
Supply Voltage-Max (Vsup) 6 V 3.6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 2.7 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish TIN LEAD NICKEL PALLADIUM GOLD
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Width 7.62 mm 5.275 mm
Base Number Matches 2 2
Length 10.2 mm
Moisture Sensitivity Level 3
Packing Method TR
Peak Reflow Temperature (Cel) 260
Power Supply Current-Max (ICC) 0.01 mA

Compare M54HC237F1 with alternatives

Compare MC74LCX139MEL with alternatives