M54HC237D vs TC74HC237P feature comparison

M54HC237D STMicroelectronics

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TC74HC237P Toshiba America Electronic Components

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer STMICROELECTRONICS TOSHIBA CORP
Part Package Code DIP DIP
Package Description DIP, DIP16,.3 DIP,
Pin Count 16 16
Reach Compliance Code not_compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
Input Conditioning LATCHED LATCHED
JESD-30 Code R-CDIP-T16 R-PDIP-T16
JESD-609 Code e0 e0
Length 20.32 mm 19.25 mm
Load Capacitance (CL) 50 pF
Logic IC Type 3-LINE TO 8-LINE DECODER 3-LINE TO 8-LINE DECODER
Max I(ol) 0.004 A
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Output Polarity TRUE TRUE
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP16,.3 DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Power Supply Current-Max (ICC) 0.08 mA
Prop. Delay@Nom-Sup 54 ns
Propagation Delay (tpd) 270 ns 225 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.83 mm 5 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 4.5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish TIN LEAD Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Total Dose 50k Rad(Si) V
Width 7.62 mm 7.62 mm
Base Number Matches 1 1
Additional Feature 3 ENABLE INPUTS

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