M52036SP
vs
TDA4691
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
MITSUBISHI ELECTRIC CORP
|
NXP SEMICONDUCTORS
|
Part Package Code |
DIP
|
DIP
|
Package Description |
SDIP, SDIP20,.3
|
0.300 INCH, PLASTIC, SOT-146-1, DIP-20
|
Pin Count |
20
|
20
|
Reach Compliance Code |
unknown
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Consumer IC Type |
SYNC SEPARATOR IC
|
SYNC SEPARATOR IC
|
JESD-30 Code |
R-PDIP-T20
|
R-PDIP-T20
|
JESD-609 Code |
e0
|
|
Length |
19 mm
|
26.73 mm
|
Number of Terminals |
20
|
20
|
Operating Temperature-Max |
85 °C
|
70 °C
|
Operating Temperature-Min |
-20 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SDIP
|
DIP
|
Package Equivalence Code |
SDIP20,.3
|
DIP20,.3
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE, SHRINK PITCH
|
IN-LINE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
4.5 mm
|
4.2 mm
|
Supply Current-Max |
45 mA
|
|
Supply Voltage-Max (Vsup) |
13 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
11 V
|
4.5 V
|
Surface Mount |
NO
|
NO
|
Technology |
BIPOLAR
|
BIPOLAR
|
Temperature Grade |
OTHER
|
COMMERCIAL
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Pitch |
1.778 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
7.62 mm
|
7.62 mm
|
Base Number Matches |
2
|
2
|
Additional Feature |
|
IT ALSO REQUIRES 7.2V TO 8.8V SUPPLY
|
Number of Functions |
|
1
|
|
|
|
Compare M52036SP with alternatives
Compare TDA4691 with alternatives