M4A3-512/192-12FAI vs XCR3512XL-12FTG256C feature comparison

M4A3-512/192-12FAI Lattice Semiconductor Corporation

Buy Now Datasheet

XCR3512XL-12FTG256C AMD

Buy Now Datasheet
Pbfree Code No
Rohs Code No Yes
Part Life Cycle Code Obsolete End Of Life
Ihs Manufacturer LATTICE SEMICONDUCTOR CORP ADVANCED MICRO DEVICES INC
Part Package Code BGA
Package Description FPBGA-256 FBGA-256
Pin Count 256
Reach Compliance Code compliant compliant
ECCN Code EAR99
HTS Code 8542.39.00.01
Additional Feature YES YES
Clock Frequency-Max 52.6 MHz 77 MHz
In-System Programmable YES YES
JESD-30 Code S-PBGA-B256 S-PBGA-B256
JESD-609 Code e0 e1
JTAG BST YES YES
Length 17 mm 17 mm
Moisture Sensitivity Level 3 3
Number of Dedicated Inputs
Number of I/O Lines 192 212
Number of Macro Cells 512 512
Number of Terminals 256 256
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 0 DEDICATED INPUTS, 192 I/O 0 DEDICATED INPUTS, 212 I/O
Output Function MACROCELL MACROCELL
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA LBGA
Package Equivalence Code BGA256,16X16,40 BGA256,16X16,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 225 260
Programmable Logic Type EE PLD EE PLD
Propagation Delay 12 ns 12 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.1 mm 1.55 mm
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 3 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish TIN LEAD TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 17 mm 17 mm
Base Number Matches 1 2
Samacsys Manufacturer AMD

Compare M4A3-512/192-12FAI with alternatives