M4A3-384/192-12FANI
vs
M4A3-384/192-65FAC
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
LATTICE SEMICONDUCTOR CORP
LATTICE SEMICONDUCTOR CORP
Part Package Code
BGA
BGA
Package Description
LEAD FREE, FPBGA-256
FPBGA-256
Pin Count
256
256
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
YES
YES
Architecture
PAL-TYPE
Clock Frequency-Max
52.6 MHz
95.2 MHz
In-System Programmable
YES
YES
JESD-30 Code
S-PBGA-B256
S-PBGA-B256
JESD-609 Code
e1
e0
JTAG BST
YES
YES
Length
17 mm
17 mm
Moisture Sensitivity Level
3
3
Number of Dedicated Inputs
Number of I/O Lines
192
192
Number of Macro Cells
384
384
Number of Terminals
256
256
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
0 DEDICATED INPUTS, 192 I/O
0 DEDICATED INPUTS, 192 I/O
Output Function
MACROCELL
MACROCELL
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA256,16X16,40
BGA256,16X16,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
250
225
Programmable Logic Type
EE PLD
EE PLD
Propagation Delay
12 ns
6.5 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.1 mm
2.1 mm
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
3 V
3 V
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
TIN SILVER COPPER
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
40
30
Width
17 mm
17 mm
Base Number Matches
1
1
Compare M4A3-384/192-12FANI with alternatives
Compare M4A3-384/192-65FAC with alternatives