M4A3-384/192-10FAI
vs
XCR3384XL-10FTG256C
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
LATTICE SEMICONDUCTOR CORP
XILINX INC
Part Package Code
BGA
BGA
Package Description
FPBGA-256
FBGA-256
Pin Count
256
256
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
3A991.D
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
YES
YES
Clock Frequency-Max
62.5 MHz
102 MHz
In-System Programmable
YES
YES
JESD-30 Code
S-PBGA-B256
S-PBGA-B256
JESD-609 Code
e0
e1
JTAG BST
YES
YES
Length
17 mm
17 mm
Moisture Sensitivity Level
3
3
Number of Dedicated Inputs
Number of I/O Lines
192
212
Number of Macro Cells
384
384
Number of Terminals
256
256
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
0 DEDICATED INPUTS, 192 I/O
0 DEDICATED INPUTS, 212 I/O
Output Function
MACROCELL
MACROCELL
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
LBGA
Package Equivalence Code
BGA256,16X16,40
BGA256,16X16,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel)
225
260
Programmable Logic Type
EE PLD
EE PLD
Propagation Delay
10 ns
10 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.1 mm
1.55 mm
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
3 V
3 V
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
TIN LEAD
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
17 mm
17 mm
Base Number Matches
1
1
Compare M4A3-384/192-10FAI with alternatives
Compare XCR3384XL-10FTG256C with alternatives