M4A3-256/128-12FAI
vs
M5LV-256/160-12YI
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
LATTICE SEMICONDUCTOR CORP
|
ADVANCED MICRO DEVICES INC
|
Part Package Code |
BGA
|
QFP
|
Package Description |
FPBGA-256
|
FQFP,
|
Pin Count |
256
|
208
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Additional Feature |
YES
|
|
Clock Frequency-Max |
52.6 MHz
|
71 MHz
|
In-System Programmable |
YES
|
|
JESD-30 Code |
S-PBGA-B256
|
S-PQFP-G208
|
JESD-609 Code |
e0
|
|
JTAG BST |
YES
|
|
Length |
17 mm
|
28 mm
|
Moisture Sensitivity Level |
3
|
|
Number of Dedicated Inputs |
14
|
|
Number of I/O Lines |
128
|
160
|
Number of Macro Cells |
256
|
|
Number of Terminals |
256
|
208
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Organization |
14 DEDICATED INPUTS, 128 I/O
|
0 DEDICATED INPUTS, 160 I/O
|
Output Function |
MACROCELL
|
MACROCELL
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
FQFP
|
Package Equivalence Code |
BGA256,16X16,40
|
QFP208,1.2SQ,20
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
FLATPACK, FINE PITCH
|
Peak Reflow Temperature (Cel) |
225
|
|
Programmable Logic Type |
EE PLD
|
EE PLD
|
Propagation Delay |
12 ns
|
17 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.1 mm
|
3.95 mm
|
Supply Voltage-Max |
3.6 V
|
3.6 V
|
Supply Voltage-Min |
3 V
|
3 V
|
Supply Voltage-Nom |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN LEAD
|
|
Terminal Form |
BALL
|
GULL WING
|
Terminal Pitch |
1 mm
|
0.5 mm
|
Terminal Position |
BOTTOM
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
17 mm
|
28 mm
|
Base Number Matches |
1
|
3
|
|
|
|
Compare M4A3-256/128-12FAI with alternatives
Compare M5LV-256/160-12YI with alternatives