M4A3-192/96-6FAC
vs
M4A3-192/96-6FANC
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
VANTIS CORP
|
LATTICE SEMICONDUCTOR CORP
|
Reach Compliance Code |
unknown
|
unknown
|
Clock Frequency-Max |
118 MHz
|
102 MHz
|
JESD-30 Code |
R-PBGA-B144
|
S-PBGA-B144
|
Number of Dedicated Inputs |
16
|
16
|
Number of I/O Lines |
96
|
96
|
Number of Terminals |
144
|
144
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Organization |
16 DEDICATED INPUTS, 96 I/O
|
16 DEDICATED INPUTS, 96 I/O
|
Output Function |
MACROCELL
|
MACROCELL
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Shape |
RECTANGULAR
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Programmable Logic Type |
EE PLD
|
EE PLD
|
Propagation Delay |
6 ns
|
6 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Supply Voltage-Max |
3.6 V
|
3.6 V
|
Supply Voltage-Min |
3 V
|
3 V
|
Supply Voltage-Nom |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Form |
BALL
|
BALL
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Base Number Matches |
2
|
1
|
Pbfree Code |
|
Yes
|
Rohs Code |
|
Yes
|
Part Package Code |
|
BGA
|
Package Description |
|
FPBGA-144
|
Pin Count |
|
144
|
HTS Code |
|
8542.39.00.01
|
JESD-609 Code |
|
e1
|
Length |
|
13 mm
|
Moisture Sensitivity Level |
|
3
|
Package Code |
|
BGA
|
Package Equivalence Code |
|
BGA144,12X12,40
|
Peak Reflow Temperature (Cel) |
|
250
|
Seated Height-Max |
|
2.1 mm
|
Terminal Finish |
|
TIN SILVER COPPER
|
Terminal Pitch |
|
1 mm
|
Width |
|
13 mm
|
|
|
|
Compare M4A3-192/96-6FAC with alternatives
Compare M4A3-192/96-6FANC with alternatives